





SPECIALTY PROCESS EXPERTISE
Nanoshift continues to challenge itself by staying current and contributing to the latest technology trends.
Nanoshift's notable specialities process expertise:
- - 3D-IC, 2.5D-IC, Chiplets
- - Conformal and Fill Coatings
- - Custom Silicon and Glass Structures
- - Damascene processes
- - Deep Reactive Ion Etching (DRIE)
- - Flex Device Fabrication
- - Glass Processing
- - Heterogenous integration (MEMS and CMOS)
- - High aspect ratio processes
- - Interconnects and Interposers
- - Non-standard Material Processing
- - Piezoelectrics
- - Polymer Processing
- - Redistribution Layers (RDL)
- - Release of structures
- - Shadow Masking
- - Silicon on Chips (SOC)
- - Solder Bump Process
- - Thru Silicon and Glass Vias (TSV and TGV)
- - Wafer Level Packaging (WLP)