Nanoshift continues to challenge itself by staying current and contributing to the latest technology trends.

Nanoshift's notable specialities process expertise:

• - 3D-IC, 2.5D-IC, Chiplets
• - Conformal and Fill Coatings
• - Custom Silicon and Glass Structures
• - Damascene processes
• - Deep Reactive Ion Etching (DRIE)
• - Flex Device Fabrication
• - Glass Processing
• - Heterogenous integration (MEMS and CMOS)
• - High aspect ratio processes
• - Interconnects and Interposers
• - Non-standard Material Processing
• - Piezoelectrics
• - Polymer Processing
• - Redistribution Layers (RDL)
• - Release of structures
• - Shadow Masking
• - Silicon on Chips (SOC)
• - Solder Bump Process
• - Thru Silicon and Glass Vias (TSV and TGV)
• - Wafer Level Packaging (WLP)