SPECIALTY PROCESS EXPERTISE

Nanoshift continues to challenge itself by staying current and contributing to the latest technology trends.

Nanoshift's notable specialities process expertise:

  • - 3D-IC, 2.5D-IC, Chiplets
  • - Conformal and Fill Coatings
  • - Custom Silicon and Glass Structures
  • - Damascene processes
  • - Deep Reactive Ion Etching (DRIE)
  • - Flex Device Fabrication
  • - Glass Processing
  • - Heterogenous integration (MEMS and CMOS)
  • - High aspect ratio processes
  • - Interconnects and Interposers
  • - Non-standard Material Processing
  • - Piezoelectrics
  • - Polymer Processing
  • - Redistribution Layers (RDL)
  • - Release of structures
  • - Shadow Masking
  • - Silicon on Chips (SOC)
  • - Solder Bump Process
  • - Thru Silicon and Glass Vias (TSV and TGV)
  • - Wafer Level Packaging (WLP)