INNOVATIVE WAFER AND CHIP-LEVEL SERVICES
Nanoshift offers cutting-edge process design and engineering, data collection, and wafer processing services for advanced semiconductors and packaging, MEMS, microfluidics, sensors, and more. Our flexible prototyping and scalable foundry services enable development of chips used in artificial intelligence (AI), automotive, battery, bio-cell and medical devices, defense, display, energy, inertial sensing, photonics, power electronics, quantum and supercomputing, virtual and augmented reality (VR/AR), and beyond. We can fabricate your micro-technology ideas.
- - Advanced Semiconductors
- - Advanced Packaging
- - MEMS
- - Microfluidics
- - Micro-scale Devices
- - Energy/Power
- - NEMS
- - Experimental Design
- - Process Integration
- - Shortloops
- - Rapid Prototyping
- - Wafer Processing
- - Foundry Services
- - Metrology
- - Damascene Process Integration
- - Deep Reactive Ion Etch (DRIE)
- - Thru Silicon Vias and Via Fill
- - 3D Wafer Level Packaging
- - Glass and Polymer Processing
- - Wafer Bonding
- - Heterogeneous Integration
20 Years
Of R&D and manufacturing services
MEMS, CMOS, 3DIC
Advanced manufacturing expertise
100, 150, 200mm
Silicon and glass wafer processing
Experimentation
Solving for data, unknowns, risk
Research, Development
Engineering and test lot processing
Wafer Processing
Low and Mid volume foundry